Backsplash / Infrastructure Slot
I owned the entire Backsplash subsystem and its component integration into Hyphen’s Makeline. Each cabinet’s power supplies, controllers and communications were housed in its Backsplash modules, alongside the display interface.
Power and controls in the cabinet
That concentration of equipment made airflow and thermal management critical. The Backsplash modules contained the brains for each cabinet, so their component integration required a complex coordination effort.
The open-enclosure photographs make the packaging problem visible: control boards, terminal rows and cable routing share the cavity behind the display array. These parts had to come together within the repeated enclosure system.
Inside the cabinet module
One display assembly across the modules
The Backsplash task estimate identifies six module configurations and calls for a common display assembly. The enclosure work depended on several interfaces being defined together: LED selections from electrical engineering, display pitch and three-dimensional location from industrial design, and CAD and connection information for an additional small board.
Display array
The mounting grid was an interface
The mounting grid located the displays and their board interfaces within that repeated geometry. The task plan called for checking whether the conductive-spring interface between the displays and PCB assemblies would deflect the grid, using spring and FR4 data and samples. Stiffness was an explicit development requirement.
An annotated comparison of the display-array face places 2D dimensions beside dimensions taken from 3D data and asks which should control. It records an interface disagreement, but not its resolution.
Rear mounting grid
Defining the optical and board geometry
The industrial-design packet specifies a number 4 brushed stainless-steel body and a dark tinted polycarbonate front. Thickness depended on the electronics package, while corner-radius and material-variant notes remained tentative. The optical intent combined a compact display with a polycarbonate diffuser and an LED grid behind its illuminated surround.
The specified Newhaven NHD-3.12-25664UCW2 is a 256 x 64 OLED module. The ID packet calls it LCD, but the named component’s datasheet identifies it as OLED. This terminology correction does not establish a technology change or identify every installed module.
My LIGHT_RING drawing, dated July 21, 2021, defines the surround with a 4 mm band and 1.75 mm and 1.05 mm thickness dimensions. The ID packet’s separate 10 mm diffuser-width note remains tentative. These are distinct design records, with a final optical stack still unestablished.
My DISPLAY_PCB drawing, dated August 25, records edge, cleanliness, hole-control and model-based definition requirements. The drawings document mechanical work within my broader subsystem responsibility. The DISPLAY_PCB drawing’s unfilled approval fields leave its formal release unestablished.
The optical stack also had a part-count question. A supplier discussion proposed a separate mask printed with dead-front black ink so the surrounds would disappear when the LEDs were off and show through when lit. It then asked whether the same printing could go directly on the back of the glass, eliminating the mask parts. The presentation records options and design intent, not a selected or qualified construction.
Light-ring geometry
Sealing and access around the package
The task plan also addresses sealing between tray and chassis, a narrower front-frame RTV seal with a bezel or overlay, buttons on the end modules, rear power switches and a fastening mechanism. The rows apply to different module combinations. They connect the internal equipment package to the surrounding cabinet and its accessible surfaces.
The hardware record
Photographs taken on November 2, 2021 document the display-board bench package, a repeated rear mounting grid with ribbon connections, and a front array with illuminated surrounds. Separate photographs record Backsplash modules in the Makeline assembly and an open internal package.
The physical record shows assembled hardware. It leaves final front construction, completed stiffness and sealing checks, quantified thermal performance and a Backsplash-specific production outcome unresolved. The task estimate records planned work rather than confirming each row’s implementation, and the subsystem-ownership account does not assign every circuit or firmware to me.
Display board on the bench
Source trail
The account combines my direct subsystem-ownership testimony with the Backsplash task estimate, industrial-design packet, named display datasheet, LIGHT_RING and DISPLAY_PCB mechanical drawings, and the two preserved assembly-photo packets.